银河集团www.198.net|中國·BinG百科 NO.1

银河集团:198net

产品中心Product Center

QSFP+/40G-10G4-DAC-30-PX 1m

Whandar\'s High Speed 40G QSFP+ to 4×10G SFP+ Direct Attach Cable copper cable assemblies are a low cost alternative for short reach 4X applications. They are designed to be fully compatible in form factor and optical/electrical connections according to the Q...

全国咨询热线:

0755-86654236 /

联系我们 在线客服

扫一扫关注我们扫一扫关注我们

产品详情

产品介绍

1. Applications

Ø  10G/40G Ethernet

Ø  InfiniBand, Fiber Channel 4G/8G/10G

Ø  Sonet Multiplatform support

Ø  High Performance Computing Clusters

Ø  High End Servers

Ø  Metro Network Switch/Cross Connect

 

2. Features

Ø  Passive Copper (Paddle cards plus Copper cable) (Cable Length: 1~5m)

Ø  4-Channel Full Passive Copper Cable Transceiver

Ø  QSFP+ conforms to the Small Form Factor SFF-8436 and SFF-8431

Ø  Support for multi-gigabit data rates up to 10.5Gbps

Ø  Data rates backward compatible to 1Gbps

Ø  Maximum aggregate data rate: 40 Gbps (4 x 10Gbps)

Ø  Hot-DensityQSFP 38-PINfootprint

Ø  I/O Connector designed for high speed differential signal applications

Ø  Improved Pluggable Form Factor(IPF) compliant for enhanced EMI/EMC performance

Ø  Compatible with industry standard SFP cages +Switches

Ø  EEPROM signature can be customized.

Ø  Temperature Range: 0~ 70 °C

Ø  RoHS-6 Compliant

3. Description

Whandar's High Speed 40G QSFP+ to 4×10G SFP+ Direct Attach Cable copper cable assemblies are a low cost alternative for short reach 4X applications. They are designed to be fully compatible in form factor and optical/electrical connections according to the QSFP Multi-Source Agreement.

QSFP+ connectors provide four channels of data in one pluggable interface. Each channel is capable of transferring data at 10Gbps and supports a total of aggregate 40Gbps as specified for QSFP+. These interconnects have three times the density of SFP+ interconnects(MSA) and have been designed to meet the harshest external operating conditions including temperature, humidity and EMI interference.

QSFP+ cable assemblies are hot swappable and the programmed EEPROM signature enables the host to differentiate

between a copper cable assembly and a fiber optic module.

Low power consumption assists in making the passive copper cable assembly an economic solution for within rack, or rack-to-rack applications.

4. standard

Ø  Compliant with electrical standards IEEE 802.3ba

Ø  Compliant with mechanical standard SFF-8436 and SFF-8431

Ø  Compliant with EEPROM standard SFF-8472

Ø  RoHS Compliant

5. Performance Specifications

5.1. Absolute Maximum Ratings

These values represent the damage threshold of the module. Stress in excess of any of the individual Absolute Maximum Ratings can cause immediate catastrophic damage to the module even if all other parameters are within Recommended Operating Conditions.

Table.1 Absolute maximum ratings

Parameter

Symbol

Min

Max

Unit

Maximum Supply Voltage

Vcc

0

3.6

V

Storage Temperature

Ts

-40

85

°C

Relative Humidity

RH

5

95

%

5.2. Recommended Operating Conditions

Table.2 Recommended Operating Conditions

Parameter

Symbol

Min

Typical

Max

Unit

Operating Case Temperature

Standard Tc

0

25

70

°C

Storage Temperature

Ts

0


70

°C

Relative Humidity

RH

5


95

%

Data Rate



10/40


Gbps

5.3. Product Characteristics

Table.3Product Characteristics

Test Type

Test Item

Target

Reference


Differential Impedence

100+/ -10ohm (Rise time of 50 ps (20 %- 80 %))

IEEE Std.802.3ba

Electrical Characteristics

Differential Mode RL

Frequency(GHz)

0.1-1.0

1.0-4.1

SDD11 & SDD22(max)

-10

-(12-2*sqrt(f))

Per table 10 of 1B

Cable MOL.v 0.68

Differential IL

Frequency

100MHz

200MHz

625MHz

1250MHz

1875MHz

2500MHz

SDD21(min)

-8

-8

-8.5

-12.1

-14.7

-17

Ref table 43 ofInfinibandArchitecture Spec, V2

NEXT

26dB @ 10MHz to 5.0GHz

/

Intra-Pair Skew

100 ps(TDT Method) Rise time of 35 ps

(20 %- 80 %)

Intra-Pair Skew

400 ps(TDT Method) Rise time of 35 ps

(20%~80 %)

EnvironmentalCharacteristics

 

Operating Temperature

-40~85°C

Cable operating temp.range

Thermal Shock

No evidence of physical damage

EIA-364-32 Test

Cyclic Temp. & Humidity

No evidence of physical damage

EIA-364-31 Method III,Test Cond A

Salt spray

48 hours salt spraying after shell corrosive area less than 5%

EIA-364-26

Temperature Life

Performance meets the specification requirement

EIA-364-17, Method A, Test Cond 3 at 105°±2°C

MechanicalCharacteristics

 

MechanicaIVibration

Performance meets the specification requirement

EIA-364-28E.11 TC-VII, Test Cond. D 15minutes in X,Y,Z axis.

Cable Flex

Performance meets the specification requirement

EIA-444-1B

Mechanical Shock

Performance meets the specification requirement

EIA-364-27B, TG-G. 3 times in 6 directions, 100g, 6ms

Cable plug Insertion

40N Max.

Per QSFP MSA Rev 1.0

Cable plug extraction

30N Max.

Per QSFP MSA Rev 1.0.

Latch retention force

50N Min. No evidence of physical damage

EIA-364-13

Durability

50 Time. No evidence of physical damage

EIA-364-09; perform plug&unplug cycles

 

5.4. Pin Definitions

图片5.png图片4.png

 

Table.4SFP Pin Definitions

PIN

Symbol

Description

Remarks

1

VEET

Transmitter ground (common with receiver ground)

Circuit ground is isolatedfrom chassis ground

2

Tx_Fault

Transmitter Fault. Not supported


3

Tx_Disable

Transmitter Disable. Laseroutput disable on high or open

Disabled: TDIS>2V or open

Enabled: TDIS<0.8V

4

SDA

2-wire Serial Interface Data Line

Should Be pulled up with4.7k – 10kohm on hostboard to a voltage between2V and 3.6V

5

SCL

2-wire Serial Interface Clock Line

6

MOD_ABS

Module Absent. Grounded within the module.

7

RS0

No connection required


8

RX_LOS

Loss of Signal indication. Logic 0 indicates normal operation

LOS is open collector output

9

RS1

No connection required


10

VEER

Receiver ground (common with transmitter ground)

Circuit ground is isolatedfrom chassis ground

11

VEER

Receiver ground (common with transmitter ground)

12

RD–

Receiver Inverted DATA out. AC coupled


13

RD+

Receiver Non-inverted DATA out. AC coupled


14

VEER

Receiver ground (common with transmitter ground)

Circuit ground is isolatedfrom chassis ground

15

VCCR

Receiver power supply


16

VCCT

Transmitter power supply


17

VEET

Transmitter ground (common with receiver ground)

Circuit ground is isolatedfrom chassis ground

18

TD+

Transmitter Non-Inverted DATA in. AC coupled


19

TD–

Transmitter Inverted DATA in. AC coupled


20

VEET

Transmitter ground (common with receiver ground)

Circuit ground is isolatedfrom chassis ground

 

图片3.png

 

Table.5QSFP Pin Definitions

Pin number

Logic

Symbol

Signal

Description

1


GND

Signal Ground

Ground

2

CML-I

Tx2n

Tx2n

Transmitter Inverted Date Input.AC coupled

3

CML-I

Tx2p

Tx2p

Transmitter Non_Inverted Date Input.AC coupled

4


GND

Signal Ground

Ground

5

CML-I

Tx4n

Tx4n

Transmitter Inverted Date Input.AC coupled

6

CML-I

Tx4p

Tx4p

Transmitter Non_Inverted Date Input.AC coupled

7


GND

Signal Ground

Ground

8

LVTTL-I

ModSelL

ModSelL

Module Select pin.Selected when held low by the host.

9

LVTTL-I

ResetL

LPMode_Reset

Module Reset.A"low" pulse induces a reset on the module.

10


Vcc Rx

Vcc Rx

+3.3V Power Supply Receiver

11

LVCMOS-I/O

SCL

SCL

2-wire serial interface

12

LVCMOS-I/O

SDA

SDA

13


GND

Signal Ground

Ground

14

CML-O

Rx3p

Rx3p

Receiver Non_Inverted Date Input.AC coupled

15

CML-O

Rx3n

Rx3n

Receiver Inverted Date Input.AC coupled

16


GND

Signal Ground

Ground

17

CML-O

Rx1p

Rx1p

Receiver Non_Inverted Date Input.AC coupled

18

CML-O

Rx1n

Rx1n

Receiver Inverted Date Input.AC coupled

19


GND

Signal Ground

Ground

20


GND

Signal Ground

Ground

21

CML-O

Rx2n

Rx2n

Receiver Inverted Date Input.AC coupled

22

CML-O

Rx2p

Rx2p

Receiver Non_Inverted Date Input.AC coupled

23


GND

Signal Ground

Ground

24

CML-O

Rx4n

Rx4n

Receiver Inverted Date Input.AC coupled

25

CML-O

Rx4p

Rx4p

Receiver Non_Inverted Date Input.AC coupled

26


GND

Signal Ground

Ground

27

LVTTL-O

ModPrsL

ModPrsL

Module Present pin.Internally grounded inside the module.

28

LVTTL-O

IntL

IntL

Interrupt by the QSFP module."Low"indicates an Alarm/Warning.

29


Vcc Tx

Vcc Tx

+3.3V Power Supply Transmitter

30


Vccl

Vccl

+3.3V Power Supply

31

LVTTL-I

LPMode

LPMode

Low Power Mode

32


GND

Signal Ground

Ground

33

CML-I

Tx3p

Tx3p

Transmitter Non_Inverted Date Input.AC coupled

34

CML-I

Tx3n

Tx3n

Transmitter Inverted Date Input.AC coupled

35


GND

Signal Ground

Ground

36

CML-I

Tx1p

Tx1p

Transmitter Non_Inverted Date Input.AC coupled

37

CML-I

Tx1n

Tx1n

Transmitter Inverted Date Input.AC coupled

38


GND

Signal Ground

Ground

Housing



Chassis Ground


 

 

5.6. Mechanical Dimensions

737804bf0b301a2143553d4b0bc0fee.png

Diagram of Mechanical Dimensions

 

6. Application Cautions

6.1. ESD

This transceiver is specified as ESD threshold 1kV for high speed pins and 2kV for all other electrical input pins, tested per MIL-STD-883, Method 3015.4 /JESD22-A114-A (HBM).  However, normal ESD precautions are still required during the handling of this module. This transceiver is shipped in ESD protective packaging. It should be removed from the packaging and handled only in an ESD protected environment.

6.2. LASER SAFTY

This is a Class 1 Laser Product according to IEC 60825-1:1993:+A1:1997+A2:2001.  This product complies with 21 CFR 1040.10 and 1040.11 except for deviations pursuant to Laser Notice No. 50, dated (July 26, 2001)

6.3. Important Notice

图片1.jpg

Note:

     1)Copper type maximum length recommended at 15 meters;

     2)Various cable lengths available for all types;

     3)Latch/tab available”on top”or”bottom”position.

 

7. Order Information

Part No.

Description

Rate

Length

Wire Gauge

HD-QSFP+/40G-10G4-DAC-30-P1

40G QSFP+ to 4 x 10G SFP+ DAC Passive

40G/ 4x 10.3G

1 meter

AWG30

HD-QSFP+/40G-10G4-DAC-30-P2

40G QSFP+ to 4 x 10G SFP+ DAC Passive

40G/ 4x 10.3G

2 meter

AWG30

HD-QSFP+/40G-10G4-DAC-30-P3

40G QSFP+ to 4 x 10G SFP+ DAC Passive

40G/ 4x 10.3G

3 meter

AWG30




菜单产品中心Product center